Designed to IEC 61076-4-OX
Up to 50 Amps per linear pcb inch
Offered in 8 and 10 positions - 3 Amps per individual contact
Designed to sequence with Z-PACK Futurebus+ backplane connectors
25 Gb/s performance (6 X 6) module
Up to 20 Gb/s performance (6 X 12) module
100 ohm differential impedance
Vertical header 6 X 12 and 6 X 6 modules
Right angle receptacle 6 X 12 and 6 X 6 modules
Select from either 3A or high conductivity 5A contacts
6 to 140 position connectors
Right-angle, vertical and straddle mount
With or without latches to retain mating pcb
Standard ISA configuration (32 + 18 pairs)
Meets PICMG 3.0 Standard
Duplex plating: 30 micro-inch gold in mating area / tin in termination area.
16 Amps per power contact, 2 Amps per signal contact
Compliant eye-of-needle pcb terminations
No additional pcb retention hardware required
ELCON Crown Band™ power contacts
Modular design allows easily customized configuration
True Hot-Plug contacts allow current interruption under load
Sequenced mating for power and signal
Unique active guide modules double as alignment guide and ground contact