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Specification |
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Series: |
mPGA/PGA (ZIF)
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Features: |
Zero Insertion Force PGA interface to package, through-hole solder attach to PCB
For Intel and AMD CPU PGA packages
Stamped and formed metal contacts
1.27mm x 2.54mm contact spacing
Socket arrays up to 462 positions |
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Series: |
PGA 插座 (LIF)
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Features: |
Low insertion force PGA interface to package, through-hole solder attach to PCB
For Intel and custom CPU packages
Screw machine outer sleeve and stamped and formed or drawn inner contact
1.27mm x 2.54mm contact spacing
Custom arrays up to 1,000+ positions |
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Series: |
PLCC 插座
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Features: |
LGA compressive interface to package, surface mount solder and through-hole solder to PCB
For plastic leaded chip carrier and PQFP packages
Stamped and formed metal contacts
1.27mm contact spacing
20, 28, 32, 44, 52, 68, 84 positions available
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Series: |
PQFP 插座
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Features: |
0.64 [.025] centerline for high density, low cost packaging
Low profile permits even higher density packaging with only 9.53 [.375] maximum height pc boards
High normal force and positive engagement insures reliable service to minimize field failures
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Series: |
CROWN EDGE微型強電流連接器
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Features: |
True Crown Band™ power contacts deliver 25 Amps per contact
VRM 10.2 designated connector for 1U and 2 U VRM applications
Surface mount, pc tail and compliant press-fit terminations
Growing family of layouts |
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Series: |
標準 Edge II (SEC II) Card Edge 和 SEC II 電源連接器
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Features: |
Integrated 22 Amp power and 5 Amp signal contacts
Vertical PCB mounting
Straddle mounting for co-planar power distribution
Multi-beam power contact design provides low resistance current transfer
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