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產品編號: |
處理器插座 |
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產品名稱: |
插座/存儲卡產品連接器 |
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產品品牌: |
TE AMP |
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PDF下載: |
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規格特性: |
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離散插座
HXC 插座
LGA 插座
矩陣系列球形格柵陣列（BGA）插座
MC-LGA 插座
mPGA/PGA (ZIF)
PGA 插座 (LIF)
PLCC 插座
PQFP 插座 |
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Discrete Sockets
Low insertion force interface to mating pin
For interconnecting a variety of pin diameters and configurations
Contacts are helical spring and crimped spring with eyelet
1.78mm contact spacing or larger
Manual to fully-automatic insertion equipment available for PCB installation
HXC Sockets
LGA compressive interface to package and PCB
For RISC based CPU and ASIC packages, Intel test sockets, board-to-board and flex-to-board interconnections
Conductive metallized polymer compound contacts
.5mm, .8mm, 1.0mm and 1.27mm contact spacing
Custom arrays available
LGA Sockets
LGA compressive interface to package, surface mount solderball attach to PCB
For Intel and AMD CPU PGA packages
Stamped and formed metal contacts
1.1mm x 1.1mm and 1.17mm x 1.09mm contact spacing
Socket arrays up to 1,200+ positions
Matrix Series Ball Grid Array (BGA) Sockets
Fully arrayed patterns available in 1.27mm, 1.00mm and 0.80mm
Allows socketing of BGA devices during prototyping and development
Array sizes up to 40 x 40 (1.27mm), 50 x 50 (1.00mm) and 60 x 60 (0.80mm)
MC-LGA Sockets
LGA compressive interface to package and PCB
For RISC based CPU and ASIC packages
Stamped and formed metal contacts
1.0mm, 1.27mm contact spacing
Socket arrays up to 7,396 positions
mPGA/PGA (ZIF)
Zero Insertion Force PGA interface to package, through-hole solder attach to PCB
For Intel and AMD CPU PGA packages
Stamped and formed metal contacts
1.27mm x 2.54mm contact spacing
Socket arrays up to 462 positions
PGA Sockets (LIF)
Low insertion force PGA interface to package, through-hole solder attach to PCB
For Intel and custom CPU packages
Screw machine outer sleeve and stamped and formed or drawn inner contact
1.27mm x 2.54mm contact spacing
Custom arrays up to 1,000+ positions
PLCC Sockets
LGA compressive interface to package, surface mount solder and through-hole solder to PCB
For plastic leaded chip carrier and PQFP packages
Stamped and formed metal contacts
1.27mm contact spacing
20, 28, 32, 44, 52, 68, 84 positions available
PQFP Sockets
0.64 [.025] centerline for high density, low cost packaging
Low profile permits even higher density packaging with only 9.53 [.375] maximum height pc boards
High normal force and positive engagement insures reliable service to minimize field failures
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