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Specification

 
Series: GBM/GBP-A
Features: ● Dimension : 5.2Øx20mm
● Ampere Rating : 0.1 ~ 15 A
● Voltage Rating (AC) : 125/250 V
● Characteristic : Fast-Acting
● Operating Temperature : -55 ℃ to 125 ℃
● Approvals : PSE, CSA, UL

 
Series: 4.2mm間距AMP-DUAC & AMP-DUAC/PL
Features: 2 - 24 positions
26 - 18 AWG
Dual row
Polarized housings
Vertical and right-angle board mount
Crimp contacts
Selective loading available on vertical headers

 
Series: LC SECURE 產品
Features: Epoxy or no epoxy styles available
No epoxy/no polish - strip, cleave and crimp
LC small form factor design is half the size of SC

 
Series: 極微型圓形連接器
Features: 7, 19 and 44 positions
One-piece seamless contacts
Wide variety of wire and cable terminations
High density

 
Series: Z-PACK TinMan 高密度底板連接器
Features: 100 ohm impedance for differential pair configuration
1.9mm x 1.4mm
Product Options: Right-angle, co-planar, mezzanine
Meets Industry reliability requirements of Bellcore/Telcordia

 
Series: Z-PACK 2mm Futurebus+ 連接器
Features: Designed to IEC 61076-4-OX
Up to 50 Amps per linear pcb inch
Offered in 8 and 10 positions - 3 Amps per individual contact
Designed to sequence with Z-PACK Futurebus+ backplane connectors

 
Series: SMA連接器
Features: Rugged connector with threaded coupling mechanism designed for performance through 12.4 GHz (standard) and 18 GHz (high frequency)
Meets all performance requirements for MIL-C 39012
Uses industry standard crimp tools and processes
Available with corrosion resistant, non-magnetic white bronze plating for low intermodulation

 
Series: SMA連接器
Features: Rugged connector with threaded coupling mechanism designed for performance through 12.4 GHz (standard) and 18 GHz (high frequency)
Meets all performance requirements for MIL-C 39012
Uses industry standard crimp tools and processes
Available with corrosion resistant, non-magnetic white bronze plating for low intermodulation

 
Series: MGS Series
Features: ■ Hermetically sealed
■ High shock & vibration
ratings
■ Mounting pads
■ Excellent RF switching
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