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Specification

 
Series: SL156連接器
Features: 0.156 centerline
2 - 24 positions
Single row housings with and without polarization tabs
Terminates 30-16 AWG discrete wire
Right angle and vertical mount headers with friction lock options
250V, 10A contact rating
Crimp and poke wire-to-board connection system
Large Insulation Diameter (LID) housing design to accommodate larger wires

 
Series: 通訊部件
Features: 2.5 Gb/s PINAMP Optical Receiver
AIRPAX Transmitters & Receivers
InGaAs PIN Photo Diode Modules
LEDs
PINAMP Optical Receiver Modules
PINFET Optical Receiver Modules
Ruggedized Transmitters & Receivers

 
Series: 蜂窩互聯產品
Features: Through-hole and surface-mount
For use in miniaturized electronic applications such as portable and cellular telephones.

 
Series: 高密度 (2mm 及 <2mm 間距)
Features: < .100 Centerline Box Connectors
DensiPac Connectors
High Density Backplane Connectors (Impact™)
MULTIGIG RT
Z-PACK 2mm FB (Futurebus+)
Z-PACK 2mm HM (Hard Metric) PCB Connectors
Z-PACK Slim UHD Connectors
Z-PACK TinMan High Density Backplane Connectors

 
Series: MULTI-BEAM XLE - Power Distribution Connector System
Features: Blind mateable power distribution system
Up to 170 Amps per linear inch

 
Series: UMCC
Features: Ultra low profile (2.0mm or 2.5mm maximum mated height)
360° mated rotation
Small footprint on PCB (3mm x 3mm)
Excellent performance to 6 GHz

 
Series: 1MSD Series
Features: ■ Suppression diode
■ Hermetically sealed
■ High shock & vibration
ratings
■ Spreader pad
■ Excellent RF switching

 
Series: HC-2
Features: • 8.0kV, No Load Switching, SPDT
• Vacuum dielectric and copper contacts for
high current carry rating of 25 Amps
• Not designed for power switching
• Stable, low contact resistance
• Meets requirements of MIL-R-83725

 
Series: PAC-GT-0930RP3-P
Features: ● Φ9.0 x H4.3 mm
● 3.0 V
● 80 mA
● 15 Ω
● 87 dB
● 3200 Hz
● 0.6 g
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