Pic
|
Specification |
|
|
|
Series: |
HTF SUB-D
|
|
|
Features: |
Crimping tool, Crimping tool for contacts, 28AWG, 20AWG, FoderBcrimp
Length 200 mm
Weight 438 g
Net weight 440.98 g
|
|
| |
|
|
|
|
Series: |
TOP 1.5GS/180-7.62 (7.62 mm, 180°)
|
|
|
Features: |
PCB terminal, 7.62 mm, 180°, Solder pin length (l): 4.5 mm, tinned, Orange, TOP connection, Clamping range, rated connection, max.: 2.5 mm², Box
IEC: 1000 V / 24 A / 0.5 - 2.5 mm²
UL: 300 V / 10 A / AWG 26 - AWG 14 |
|
| |
|
|
|
|
Series: |
連接器緩衝器
|
|
|
Features: |
Preserve permanently mounted connectors in high use applications
|
|
| |
|
|
|
|
Series: |
PCG/PCG 3mm
|
|
|
Features: |
Dimensions(L x W x H)(mm):28.2 x 14.2 x 24.9
2 Form A (DPST-NO).
5A @ 250VAC resistive, 100,000ops.
8A @ 250VDC resistive, 50,000ops.
TV-5 @ 120VAC Tungsten, 25,000ops.
Max. Switched Current: 10A.
Max. Switched Voltage: AC 277V/DC 30V. |
|
| |
|
|
|
|
Series: |
MTA-50, MTA-100, MTA-156, CST-100 及 SL-156 插座和插頭
|
|
|
Features: |
IDC, wire-to-board and wire-to-wire connector system with contacts in an 0.050", 0.100" or 0.156" centerline
Flat, friction lock and fully shrouded headers
Terminates 30-18 AWG discrete wire or ribbon cable
Closed end and feed-through receptacles
Right-angle and vertical mount headers
Tin, 15 and 30 gold plating options
|
|
| |
|
|
|
| |
|
|
|
| |
|
|
|
|
Series: |
AMPMODU .031 X .062 (.200) 互聯繫統 (Mod I)
|
|
|
Features: |
Rugged wire-to-board, board-to-board discrete wire system featuring 0.031 x 0.062 posts
Housing size 1-20 positions
Posts available on strip for machine application directly to OPCB or in housings for board mounting
|
|
| |
|
|
|
|
Series: |
可插拔匯流條連接器和插座
|
|
|
Features: |
Silver plated high conductivity copper contacts
Stainless steel guide/anti-overstress plate
Right-angle and vertical orientations
For use with 0.062" and 0.125" thick solid copper bus bars
|
|
| |
|
|
