Pic
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Specification |
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Series: |
PAC-PT-1003S-P
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Features: |
● Φ10.0 x H3.1 mm
● 5.0 V
● 5 mA
● 75 dBA
● 5200 Hz
● 0.3 g
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Series: |
CQ-211N
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Features: |
● For ATQ Blade Type Fuse
● Rated Current : 30A
● Insulation Resistance At 500VDC : 100MΩ Min
● Contact Resistance : 5mΩ At 1A DC
● Dielectric Strength For 60 Sec : AC2000V Min.
● Body Material : Nylon.
● Supply Standard UL Wire-AWG/Length : 12#AWG / 8”Loop
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Series: |
PCF 7.50/135 (7.50 mm, 135°)
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Features: |
PCB terminal, 7.50 mm, 135°, Solder pin length (l): 3.5 mm, tinned, Orange, Flat-blade connection, Box
IEC: 1000 V / 24 A
UL: 300 V / 15 A |
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Series: |
TSVB-S
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Features: |
● Size : 6.0 x 6.0 x 3.9 mm
● Operating temperature range : －20℃ to ＋70℃
● Electrical performance
- Rating : 50mA, 12V DC
- Insulation resistance : 100MΩ min. 100V DC
- Dielectric strength : 250V AC for 1 min.
- Contact resistance : 100mΩ max.
● Lifetime : 50,000 Cycles, 100,000 Cycles
● Mechanical performance
- Operating force : 1:100 ± 50gf, 2:160 ± 50gf, 3:260 ± 70gf
- Travel : 0.25 ± 0.1mm
● Improve mounting density of components on PC board.
● Reflow solderable.
● Contacts are completely sealed, enhancing reliability.
● Packaged with a 12mm wide embossed taping. |
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Series: |
模塊耦合器
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Features: |
In-line and right-angle
Modular jack to modular jack
Modified modular jack to modular jack
Modified modular jack to modified modular jack
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Series: |
DUO-TYNE 旗
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Features: |
16-26 gauge
Right-angle
Wire-to-Board
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Series: |
標準 Edge II (SEC II) Card Edge 和 SEC II 電源連接器
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Features: |
Integrated 22 Amp power and 5 Amp signal contacts
Vertical PCB mounting
Straddle mounting for co-planar power distribution
Multi-beam power contact design provides low resistance current transfer
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Series: |
Siemax
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Features: |
Applications include multiplex systems, base stations and high density systems
Component placement on both sides of PCB
Fully automated assembly (pick-and-place)
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