LGA compressive interface to package and PCB
For RISC based CPU and ASIC packages, Intel test sockets, board-to-board and flex-to-board interconnections
Conductive metallized polymer compound contacts
.5mm, .8mm, 1.0mm and 1.27mm contact spacing
Custom arrays available
Content：
12F., No.27-8,
Sec. 2, Jhongjheng E. Rd., Danshuei Township, Taipei
County 251, Taiwan (R.O.C.)
TEL:886-2-2808-0678 FAX:886-2-2808-0066
