LGA compressive interface to package, surface mount solderball attach to PCB
For Intel and AMD CPU PGA packages
Stamped and formed metal contacts
1.1mm x 1.1mm and 1.17mm x 1.09mm contact spacing
Socket arrays up to 1,200+ positions
Content：
12F., No.27-8,
Sec. 2, Jhongjheng E. Rd., Danshuei Township, Taipei
County 251, Taiwan (R.O.C.)
TEL:886-2-2808-0678 FAX:886-2-2808-0066
